- 4 PCBs Designed
- Schematic Created
- Layout Design
- Thin Paralux Material
- Dupont Material
- Double Sided
- PCB FAB and Delivered to Customer
- PCB Design, Schematic & BOM
- PCB FAB, Assembly, Firmware
- Customer Testing
- CC3235MODS TI IC Chip
- Supported 3 Analog Sensors
- RFMD RFFC5071A and CC1352R
- RF Component 5.8GHZ
- Programming & Debugging
- Pressure & Temperature Sensor Implementation
- 60-hour project
- Created Specs, Circuit Design, Schematic, and BOM
- PCB Layout and Routing
- Hardware Testing and Troubleshooting
- Prototyping 1, 2nd generation
- Preproduction
- Preparing for production
- Complete Redesign of Product Line
- Specs, Circuit Design, Schematic, and BOM
- Product research and specifications
- Component selection and sourcing
- Component placements and routing
- Electrical isolation and high-voltage / high-current routes,
- high heat design
- MFG fab notes and file outputs
- 3D Drawings & Details
- Complete Redesign
- Maintained foot print
- Reduced chip count
- enhanced performance
- Reduced cost
- Ease of Assembly – less hand solder components
- Design and Engineering of custom AC to DC circuit and
- PCB and replace the failed AC to DC power converter with new designed part and full schematic
- 3D PDF for review
- PCB Layout
- All Fabrication files (gerbers, drill, manufacturing specifications, layer stack drawing, drill drawing)
- DRC check report
- Complete package of Altium Project files
- One full turn build (includes, material, parts, and packing material)
- Four extra fabricated PCB’s for future builds.
- Replace capacitors with upgraded parts.
- Add heatsink with thermal conductive paste for adhesion to bottom side where components are showing excess heat.
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