Flex Design Basics
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Always try to avoid “stacking traces” in the same location from layer to layer.
Stress from bending/flexing can cause issues with the copper pads maintaining adhesion to the base material. The addition of copper extending under the coverlay will help maintain the adhesion of the pads.
The general guideline for calculating minimum bend radius is 10X the total thickness of the flexible circuit for double sided (2 layer) applications.
The general guideline for calculating minimum bend radius is 6X the total thickness of the flexible circuit for single sided (1 layer) applications.
The general guideline for calculating minimum bend radius is 20X -25X the total thickness of the flexible circuit for multi-layer (3+ layers) applications.
PCB Solutions recommends Taiflex material for most flexible applications, due to cost, performance and lead-time overseas.