| Preferred Materials | |
|---|---|
| FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya |
| FR4 Mid Tg (Lead Free Compatible) | Shengyi S1000, ITEQ IT158 |
| FR4 High Tg (Lead Free Compatible) | Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V |
| High Performance Low Loss FR4 | EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I‐Speed, I‐Tera MT Nelco N4000‐13EP, EPSI Panasonic R5775 Megtron 6 |
| RF Materials | Rogers RO4350, RO3010 Taconic RF‐30, RF‐35, TLC, TLX, TLY Taconic 601, 602, 603, 605 |
| Halogen Free | EMC EM285, EM370(D) Panasonic R1566 |
| Aluminum Backed PCB | Shengyi SAR20, Yugu YGA |
| Additional Materials |
|---|
| Rigid Polyimide: Shengyi SH260, Ventec VT901 |
| BT Epoxy: Nelco and Mitsubishi |
| High CTI FR4: Shengyi S1600 |
| Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi |
| Surface Finishes |
|---|
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
| PCB Technologies | Standard | Advanced |
|---|---|---|
| Rigid‐Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance Control | ± 10% | ± 5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum PCB's | Y | Y |
| Non‐Conductive Via Fill (VIP) | Y | Y |
| Conductive Via Fill | Y | Y |
| Cavity Boards | Y | Y |
| Backdrilling | Y | Y |
| Controlled Depth Drill and Rout | Y | Y |
| Edge Plating | Y | Y |
| Buried Capacitance | Y | Y |
| Etch Back | Y | Y |
| In‐board Beveling | Y | Y |
| 2‐D Bar Code Printing | Y | Y |
| Standard Features | Standard | Advanced |
|---|---|---|
| Maximum Layer Count | 20 | 36 |
| Maximum Panel Size | 533x610mm [21x24"] | 610x1067mm [24x42"] |
| Outer Layer Trace/Spacing (1/3oz starting foil + platig) | 90µm/90µm [0.0035"/0.0035"] | 64µm/76µm [0.0025"/0.003"] |
| Inner Layer Trace/Spacing (Hoz inner layer cu) | 76µm/76µm [0.003"/0.003"] | 50µm/50µm [0.002"/0.002"] |
| Maximum PCB Thickness | 3.2mm [0.125"] | 6.5mm [0.256"] |
| Minimum PCB Thickness | .20mm [0.008"] | .10mm [0.004"] |
| Minimum Mechancial Drill Size | .20mm [0.008"] | .10mm [0.004"] |
| Minimum Laser Drill Size | .10mm [0.004"] | .08mm [0.003"] |
| Maximum PCB Aspect Ratio | 10:1 | 25:1 |
| Maximum Copper Weight | 5 oz [178µm] | 6 oz [214µm] |
| Minimum Copper Weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
| Minimum Core Thickness | 50µm [0.002"] | 38µm [0.0015"] |
| Minimum Dielectric Thickness | 64µm [0.0025"] | 38µm [0.0015"] |
| Minimum Pad Size Over Drill | 0.46mm [0.018"] | 0.4mm [0.016"] |
| Solder Mask Registration | ± 50µm [0.002"] | ± 38µm [0.0015"] |
| Minimum Solder Mask Dam | 76µm [0.003"] | 64µm [0.0025"] |
| Copper Feature to Edge, V‐cut (30°) | 0.40mm [0.016"] | 0.36mm [0.014"] |
| Copper Feature to PCB Edge, Routed | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Tolerance on Overall Dimensions | ± 100µm [0.004"] | ±50µm [0.002"] |
| HDI Features | Standard | Advanced |
|---|---|---|
| Minimum Microvia Hole Size | 100µm [0.004"] | 75µm [0.003"] |
| Capture Pad Size | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Glass Reinforced Dielectrics | Y | Y |
| Maximum Aspect Ratio | 0.7:1 | 1:1 |
| Stacked Microvias | Y | Y |
| Copper Filled Microvias | Y | Y |
| Buried Filled Vias | Y | Y |
| Maximum No. of Buildup Layers | 3+N+3 | 5+N+5 |
| Advanced Processes |
|---|
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask |
| Direct Plating for High Layer Count and Microvias Products |
| Reverse Pulse Plating |
| Solid Copper Plated PTH Vias |
| XACT Tooling System for Improved Layer‐to‐Layer Registration |
| Spray Coating for Soldermask |
| Inkjet Printing for Legend |
| In‐Line AOI for Outerlayers and AOI for Final Inspection |
| ORMET® Copper Paste for Any‐layer Connections |
| ZETA® Material for HDI and Low‐Loss Applications |
| Quality System and Certifications |
|---|
| "IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and Class III)"Class III) |
| "Quality System Certifications: ISO 9001:2008, TS16949:2009, ISO13485: 2003"2003 |
| Environmental Certifications: ISO14001:2004, ISO/TS14067:2013 |
| UL Certification: File number E229342 |