Expanded Summary Process Capability

Preferred Materials
FR4 Standard TgShengyi, ITEQ, KB, Nanya
FR4 Mid Tg (Lead Free
Shengyi S1000, ITEQ IT158
FR4 High Tg
(Lead Free Compatible)
Shengyi S1000‐2, S1170
Isola 370HR
Panasonic R1755V
High Performance
Low Loss FR4
EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6
RF MaterialsRogers RO4350, RO3010
Taconic RF‐30, RF‐35, TLC, TLX, TLY
Taconic 601, 602, 603, 605
Halogen FreeEMC EM285, EM370(D)
Panasonic R1566
Aluminum Backed PCBShengyi SAR20, Yugu YGA
Additional Materials
Rigid Polyimide:  Shengyi SH260, Ventec VT901
BT Epoxy:  Nelco and Mitsubishi
High CTI FR4:  Shengyi S1600
Flexible Circuit Materials:  Dupont, Panasonic, Taiflex, Shengyi
Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM
PCB TechnologiesStandardAdvanced
Rigid‐Flex & Flexible CircuitsYY
Buried and Blind ViasYY
Sequential LaminationYY
Impedance Control± 10%± 5%
Hybrids & Mixed DielectricsYY
Aluminum PCB'sYY
Non‐Conductive Via Fill (VIP)YY
Conductive Via FillYY
Cavity BoardsYY
Controlled Depth Drill and RoutYY
Edge PlatingYY
Buried CapacitanceYY
Etch BackYY
In‐board BevelingYY
2‐D Bar Code PrintingYY
Standard FeaturesStandardAdvanced
Maximum Layer Count2036
Maximum Panel Size533x610mm [21x24"]610x1067mm [24x42"]
Outer Layer Trace/Spacing
(1/3oz starting foil + platig)
Inner Layer Trace/Spacing
 (Hoz inner layer cu)
Maximum PCB Thickness3.2mm [0.125"]6.5mm [0.256"]
Minimum PCB Thickness.20mm [0.008"].10mm [0.004"]
Minimum Mechancial Drill Size.20mm [0.008"].10mm [0.004"]
Minimum Laser Drill Size.10mm [0.004"].08mm [0.003"]
Maximum PCB Aspect Ratio10:125:1
Maximum Copper Weight5 oz [178µm]6 oz [214µm]
Minimum Copper Weight1/3 oz [12µm]1/4 oz [9µm]
Minimum Core Thickness50µm [0.002"]38µm [0.0015"]
Minimum Dielectric Thickness64µm [0.0025"]38µm [0.0015"]
Minimum Pad Size Over Drill0.46mm [0.018"]0.4mm [0.016"]
Solder Mask Registration± 50µm [0.002"]± 38µm [0.0015"]
Minimum Solder Mask Dam76µm [0.003"]64µm [0.0025"]
Copper Feature to Edge, V‐cut (30°)0.40mm [0.016"]0.36mm [0.014"]
Copper Feature to PCB Edge, Routed0.25mm [0.010"]0.20mm [0.008"]
Tolerance on Overall 
± 100µm [0.004"]±50µm [0.002"]
HDI FeaturesStandardAdvanced
Minimum Microvia Hole Size100µm [0.004"]75µm [0.003"]
Capture Pad Size0.25mm [0.010"]0.20mm [0.008"]
Glass Reinforced DielectricsYY
Maximum Aspect Ratio0.7:11:1
Stacked MicroviasYY
Copper Filled MicroviasYY
Buried Filled ViasYY
Maximum No. of Buildup Layers3+N+35+N+5
Advanced Processes
Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer‐to‐Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In‐Line AOI for Outerlayers and AOI for Final Inspection
ORMET® Copper Paste for Any‐layer Connections
ZETA® Material for HDI and Low‐Loss Applications
Quality System and Certifications
"IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and 
Class III)"Class III)
"Quality System Certifications:  ISO 9001:2008, TS16949:2009, ISO13485:
Environmental Certifications: ISO14001:2004, ISO/TS14067:2013
UL Certification:  File number E229342