CategoryAttributeCurrentNear TermLong Term
Fine Line/SpaceInner Layers (Line/Space)
Outer Layers (Line/Space)
3/3 mil
3/4 mil
2.5/2.5 mil
3/3 mil
2/2 mil
2.5/2.5 mil
Buried Core HolesMechanical (Drilled Hole/Land)
Laser Drill (Drilled Hole/Land)
5.9/12 mil
N/A
4/10 mil
4/13 mil
2.5/2.5 mil
3.5/8 mil
Special ProcessingControlled Depth Drilling - Blind Vias
Sequential Lamination - Buried Vias
Via in Pad Technology - Silver Epoxy
Via in Pad Technology - Non Conductive Epoxy
Edge Plating
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MaterialsHigh TD - RoHS
Halogen Free
High Performance
Polyimide - High Temp
Teflon
High Speed RF Signals
Yes
Yes
Dk-3.0 Df<0.005
Yes
Yes
Yes
Yes
Yes
Dk<3.0 Df<0.005
Yes
Yes
Yes
Yes
Yes
Dk<3.0 Df<0.002
Yes
Yes
Yes
Through Via HolesDrilled Hole/Land
Registration to Internal Land
Maximum Copper Plating Aspect Ratio
5.9/12 mil
+/-5.0 mil
15:1.0
4/10 mil
+/-4.5 mil
18:1.0
3.5/8 mil
+/-4.0 mil
20:1.0
Panel / BoardMaximum Layer Count
Maximum Thickness
Maximum Process Panel Size
50 layer
0.40
24" x 30"
60 layer
0.40
24" x 30"
60+ layer
0.40
24" x 30"
ImpedanceSingle ended & Differential Pair Tolerance+/- 5%+/- 5%+/- 5%
Imbedded PassivesResistors
Capacitance/Capacitors
N/A
2.0 mil Core
+/- 15%
1.0 mil Core
+/- 10%
Thin Film
Surface FinishSMOBC
HASL
Lead Free HASL
Electrolytic Hard Gold
Electrolytic Soft Gold
Palladium
Nickel
Carbon Ink
Electroless Ni/Au
Immersion Silver
Immersion Tin
Organic Surface Protection (Entek)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Quality StandardsISO 9001/2000
IPC 6012 Class 1,2,3
TL 9000
Mil-PRF-31032
Yes
Yes
No
No
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes

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