| Category | Attribute | Current | Near Term | Long Term |
|---|---|---|---|---|
| Fine Line/Space | Inner Layers (Line/Space) Outer Layers (Line/Space) | 3/3 mil 3/4 mil | 2.5/2.5 mil 3/3 mil | 2/2 mil 2.5/2.5 mil |
| Buried Core Holes | Mechanical (Drilled Hole/Land) Laser Drill (Drilled Hole/Land) | 5.9/12 mil N/A | 4/10 mil 4/13 mil | 2.5/2.5 mil 3.5/8 mil |
| Special Processing | Controlled Depth Drilling - Blind Vias Sequential Lamination - Buried Vias Via in Pad Technology - Silver Epoxy Via in Pad Technology - Non Conductive Epoxy Edge Plating | Yes Yes Yes Yes Yes | Yes Yes Yes Yes Yes | Yes Yes Yes Yes Yes |
| Materials | High TD - RoHS Halogen Free High Performance Polyimide - High Temp Teflon High Speed RF Signals | Yes Yes Dk-3.0 Df<0.005 Yes Yes Yes | Yes Yes Dk<3.0 Df<0.005 Yes Yes Yes | Yes Yes Dk<3.0 Df<0.002 Yes Yes Yes |
| Through Via Holes | Drilled Hole/Land Registration to Internal Land Maximum Copper Plating Aspect Ratio | 5.9/12 mil +/-5.0 mil 15:1.0 | 4/10 mil +/-4.5 mil 18:1.0 | 3.5/8 mil +/-4.0 mil 20:1.0 |
| Panel / Board | Maximum Layer Count Maximum Thickness Maximum Process Panel Size | 50 layer 0.40 24" x 30" | 60 layer 0.40 24" x 30" | 60+ layer 0.40 24" x 30" |
| Impedance | Single ended & Differential Pair Tolerance | +/- 5% | +/- 5% | +/- 5% |
| Imbedded Passives | Resistors Capacitance/Capacitors | N/A 2.0 mil Core | +/- 15% 1.0 mil Core | +/- 10% Thin Film |
| Surface Finish | SMOBC HASL Lead Free HASL Electrolytic Hard Gold Electrolytic Soft Gold Palladium Nickel Carbon Ink Electroless Ni/Au Immersion Silver Immersion Tin Organic Surface Protection (Entek) | Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes | Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes | Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
| Quality Standards | ISO 9001/2000 IPC 6012 Class 1,2,3 TL 9000 Mil-PRF-31032 | Yes Yes No No | Yes Yes Yes No | Yes Yes Yes Yes |
