PCB Solutions just finished another flex printed circuit board (partial) engineering and design project that was a big hit with our customer. Noted below is a project we just completed which we helped with the material construction which included the stack-up details. Here are some of components of the fabrication of this Flex PCB:
- ½ oz copper core plated to 1oz finished copper
- Electroless Immersion Gold (ENIG)
- Material: DuPont Kapton;
- 2 conductor layers,
- 1 oz. copper,
- 1 mil Kapton;
- Overall board thickness: 0.007” ± 0.002”. 0.2mm +/- .03mm thickness
The customer presented us with the basic drawing and Gerbers files of the board layout. Our engineers took the files from there and made recommendations on stackup to make sure the customer could meet the specs they desired.
With PCB Solutions, you receive so much more than a finished product – which includes but is not limited to factory engineered drawings of your product and all the outgoing reports showing final inspection results. We go the extra mile prior to production to make sure the product is what the customer needs and then send the documentation to prove results.
Partial Final Engineering Drawings supplied from our process engineers:
Final Inspection Reports detailing the specifications of the Flex PCB:
| Customer | PCB Solution | ||
| Customer P/N | |||
| Customer P/O | 13763 | ||
| P/N | D06742 |
Lot Number |
41pcs |
| Standard |
IPC-6013A |
Qty |
8pcs |
- Materials
| Item | Requirement |
Result |
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| Structure | Flex Board 2 Layer（s）Rigid-Flex Board Layers |
Acc |
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| Base Film | ■PI | 0.5mil 1mil 2mil Other milAdhesive Adhesiveless |
Acc |
|||
| Base Copper | ■ED | 0.5oz 1oz 2oz Other oz |
Acc |
|||
| Laminate | FR4 Other |
/ |
||||
| Coverlay | ■PI | 0.5mil 1mil 2mil Other mil |
Acc |
|||
| Stiffener | ■PI FR4 Other |
/ |
||||
| Stiffener Adhesive | 3M467 Hot Cured Adhesive Other |
/ |
||||
| Solder mask | Type | 颜色Color |
/ |
|||
| Nanya Taiyo psr-4000Other | Green YellowBlack Other |
/ |
||||
| C/M | Type | Color |
Position |
/ |
||
| ZM-400WFM-211WOther | White BlackOther | TopBottom | ||||
2、Electric Test
|
Test Condition |
Result |
|||
|
Test Voltage |
Test Current |
Conductive Resistance |
Insulation Resistance |
Acc |
|
150V |
180mA |
10Ω |
100MΩ |
|
3. Line Wide & Spacing Measurement （Unit: mm）
|
Item |
Requirement |
Actual |
Result |
||
4.Surface Plating Technic & Plating Thickness
| Requirement | Actual |
Result |
| ENIG |
Thickness: Ni (1-3um); Au (0.025-0.05um) ENIG
Thickness: Ni ( 1.3 um); Au ( 0.03 um)
Acc
Plating Gold
Thickness: Ni (1-3um)Au(0.05~0.075 um) Plating Gold
Thickness: Ni ( um); Au ( um) Flash Gold
Thickness: Ni (2~5um); Au (0.05~0.1um) Flash Gold
Thickness: Ni ( um); Au ( um) Gold Finger
Thickness: Ni (2~5um); Au (0.05~0.1um) Gold Finger
Thickness: Ni ( um); Au ( um) HAL
Thickness: Sn (2~40um) HAL
Thickness: Sn ( um) HAL Lead-Free
Thickness: Sn (3~7um) HAL Lead-Free
Thickness: Sn ( um) Immersion Tin
Thickness: Sn (0.25~1um) Immersion Tin
Thickness: Sn ( um) Immersion Ag
Thickness: Ag (≥0.8um) Immersion Ag
Thickness: Ag ( um)OSP
Thickness: OSP (0.3~0.5um) OSP Thickness: OSP( um)
5. Marking Inspection
|
Item |
Requirement |
Actual |
Result |
|
Inspection |
FP Logo |
Additional Marking
UL Logo
Date CodeFP Logo
Additional Marking
UL Logo
yyww wwyy
6.Size Measurement Unit mm）
|
Item |
Requirement |
Actual |
Result |
|||
| Board Thickness |
Rigid |
/ |
/ |
/ |
/ |
/ |
|
Flex |
/ |
/ |
/ |
/ |
/ |
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|
Stiffener Area Thickness |
/ |
/ |
/ |
/ |
/ |
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/ |
/ |
/ |
/ |
/ |
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|
/ |
/ |
/ |
/ |
/ |
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|
Outline Size |
29.91±0.10 |
29.92 |
29.90 |
29.92 |
Acc |
|
|
5.19±0.10 |
5.20 |
5.21 |
5.20 |
Acc |
||
|
/ |
/ |
/ |
/ |
/ |
||
|
/ |
/ |
/ |
/ |
/ |
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Warpage Measurement |
/ |
/ |
/ |
/ |
/ |
|
|
V-CUT V-CUT Measurement |
B: H: &: |
B: H: &: |
B: H: &: |
B: H: &: |
/ |
|
|
Gold Finger Measurement
|
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7. Mechanical Dimension
PROFILE |
HOLE |
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|
SPEC & TOL(MM.) |
RESULT(MM.) |
SPEC & TOL(MM.) |
RESULT |
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|
1 |
29.91±0.10 |
29.92 |
29.90 |
29.92 |
29.91 |
29.92 |
/ |
/ |
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|
2 |
5.19±0.10 |
5.20 |
5.21 |
5.20 |
5.19 |
5.20 |
/ |
||||||||||||||||
|
3 |
1.00±0.05 |
1.01 |
1.00 |
1.02 |
1.00 |
1.01 |
|||||||||||||||||
|
4 |
0.50±0.05 |
0.50 |
0.49 |
0.51 |
0.48 |
0.50 |
|||||||||||||||||
|
5 |
0.20±0.03 |
0.21 |
0.20 |
0.20 |
0.21 |
0.20 |
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Resistance Measurement Report |
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SPEC & TOL(ohm) |
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RESULT(ohm)
OK/NG
1
/
/
2
3
4
8. Visual Inspection
|
Inspection Standard |
Requirement |
Actual |
Result |
|
IPC-6013 IPC-6013 & Customer requirement |
No Visual defects
No defects
Acc
9. Other Requirement
(120℃，120）。The PCB need to bake before solder (Temp 120℃,Time 120min).